Electroformed Bellows CouplingsFor Semiconductor Packaging Bonding Heads

Bond heads pick, align and place semiconductor dies. Compact motion assemblies require transmission of torque with controlled axial, lateral and angular compliance, minimal backlash and low parasitic load.

Thin-wall electroformed convolutions offer low inertia, zero mechanical backlash and controlled flexibility. The coupling geometry and end connections can be tailored to stiffness, alignment and packaging requirements.

Besi (Netherlands) and ASMPT (Singapore) publish semiconductor packaging equipment with precision bond-head mechanisms, providing useful references for compact motion integration. Model-specific images must come from the manufacturers’ published materials.

Custom electroformed bellows couplings: shaft diameters, end attachments, torque, misalignment, operating frequency and cleanliness requirements.